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Metalworks
Products >> eWLB Metal Wafer Carriers (FOWLP Metal Wafer Carriers)
eWLB Process Flow(embedded Wafer Level BGA)
eWLB manufacturing is distinguished by an innovative process where an artificial wafer is created by embedding pre-diced silicon chips onto a blank metal carrier.
Benefited from the high precise manufacturing experiences and vast cooperations with those advanced packaging players, we established leading status on the metal wafer carriers by our excellent performance on warpage controlling, precision machining, surface grinding etc.
eWLB technology provides significant performance, many different size and cost benefits, compared to other technology available today.
